The motherboard supports DDR3 memory that features data transfer rates of 2200(O.C.) / 1600 /1333 / 1066 MHz to meet the higher bandwidth requirements of the latest 3D graphics, multimedia, and Internet applications. The dual-channel DDR3 architecture enlarges the bandwidth of your system memory to boost system performance. Experience ultra-fast data transfers at 4.8Gbps with USB 3.0--the latest connectivity standard. Built to connect easily with next-generation components and peripherals, USB 3.0 transfers data 10X faster and is also backward compatible with USB 2.0 components. Supporting next-generation Serial ATA (SATA) storage interface with onboard Marvell controller, this motherboard delivers up to 6.0Gbps data transfer rates. Additionally, get enhanced scalability, faster data retrieval, double the bandwidth of current bus systems. The Heat Pipe design effectively directs the heat generated by the chipsets to the heatsink near the back IO ports, where it can be carried away by existing airflow from CPU fan or bundled optional fan. The purpose of the innovative heat pipe design on this motherboard is that the groundbreaking fanless design does not have lifetime problems as a chipset fan does. Furthermore, it provides options for users to install side-flow fan or passive cooler. The Heat Pipe design is the most reliable fanless thermal solution to date.
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