Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler. Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer. Ceramic-based compound that is electrically non-conductive, for safe use around electronics. Replace old or dried out thermal paste to replenish heat dispersion between a CPU and heatsink. System builders who put together many low-end to mainstream systems.
- Ceramic-based compound containing silicone
- Thermal conductivity of more than 1.066 W/m-K