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Kingston HyperX Impact 8GB (2x4GB) Memory Kit 1600MHz DDR3L CL9 SODIMM Non-ECC Unbuffered 1.35V

£84.00 » £47.15 with Free Delivery
Debit Card Discounted Price: £47.05

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Product Part Numbers

  • Quick Find Code: K469265
  • Manufacturers SKU: HX316LS9IBK2/8
  • Product UPC/EAN: 740617233353

Product Description

HyperX HX316LS9IBK2/8 is a kit of two 512M x 64-bit (4GB) DDR3L-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8, low voltage, memory modules, based on eight 512M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has been tested to run at DDR3L-1600 at a low latency timing of 9-9-9 at 1.35V or 1.5V.

Main Features:

  • JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V) Power Supply
  • VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
  • 800MHz fCK for 1600Mb/sec/pin
  • 8 independent internal bank
  • Programmable CAS Latency: 11, 10, 9, 8, 7, 6
  • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
  • 8-bit pre-fetch
  • Burst Length: 8 (Interleave without any limit, sequential with starting address '000' only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
  • Bi-directional Differential Data Strobe
  • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
  • Asynchronous Reset
  • PCB : Height 1.180 inch (30.00mm), double sided component
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MEMORY Memory Speed 1600MHz
Pin Configuration 204 pins
CAS Latency CL9
Memory Type DDR3L
Memory Size 8192MB (2 module(s) x 4096MB)
Memory Package SO-DIMM
Bus I/O Configuration Unbuffered
Error Correction Non ECC
ELECTRICAL Voltage 1.35V
ENVIRONMENTAL Operating Temperature 0 to 85°C
Non Operating Temperature -55 to +100°C
PHYSICAL Case Colour Black
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